Mayware Formula IV PL S4/D

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Brand: Mayware

Mayware Formula IV PL S4/D is a synthetic, non-toxic, fast-drying, and water-based adhesive specifically designed for high-precision bonding applications in the semiconductor and microelectronics industry. Its formulation offers excellent adhesion to several substrate materials such as Silicon, Silicon Carbide, Glass, Sapphire, Quartz, Plastic, and Metals. The S4/D designation refers to the adhesive's properties: S4 indicates that it has a shear strength of at least 4 N/cm2 and D refers to its dual cure capability. This dual cure feature allows for both thermal and anaerobic curing options, providing flexibility in bonding techniques and process requirements. Mayware Formula IV PL S4/D also offers excellent resistance to thermal shock, humidity, and chemicals, making it a reliable and long-lasting adhesive for semiconductor manufacturing processes.

Effective Length: 224 mm
Overhang: 15 mm
Offset Angle: 22°
Pivot to Spindle: 209 mm
Cartridge Range:
Effective Mass: 4.5 g
VTA Adjust:
Arm Mount: 25 mm
Headshell:
Null Points: 60.5 / 107.3 mm