DCM C520
Brand: Dcm
The DCM C520 is a fan-out wafer-level packaging (FOWLP) solution developed by Amkor Technology. FOWLP is a packaging technology that allows for the integration of multiple dies onto a single interposer or substrate. The DCM C520 represents the latest iteration of Amkor's FOWLP technology and is designed to address the increasing demand for high-density, low-power, and mixed-signal applications in the automotive,IoT, industrial, and consumer markets.Some key features and benefits of the DCM C520 include:1. Package densities up to 3,500 I/Os2. Low power consumption and reduced die count due to system-level packaging of multiple signals and functions3. Reduced board area and product size due to smaller footprint and fewer required packaging components4. High-reliability capabilities for harsh environments, such as automotive and industrial applications5. Compatibility with existing designs and manufacturing processesThe DCM C520 is also customizable to fit specific application requirements, such as varying input/output configurations and package heights. By providing advanced FOWLP solutions like the DCM C520, Amkor Technology is addressing important market needs for smaller, higher-performing, and lower-cost packaging solutions that support the evolving requirements of today's electronic devices.
- Type: 2 way, 2 driver loudspeaker system
- Frequency Response: 60Hz to 20kHz
- Sensitivity: 85dB
- Crossover frequency: 4000Hz
- Impedance: 8Ω
- Power handling: 50W
- Recommended Amplifier:
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